Device and method of forming a unitary electrically shielded panel

ABSTRACT

A device and method of unitarily forming an electrically shielded panel for use in electromagnetically sealing an opening defined in an electronic enclosure. The unitary electrically shielded panel is formed of an electrically non-conductive rigid thermoplastic panel part and a substantially planar, electrically conductive elastomeric gasket bonded together to form the unitary panel in a single tool during a single injection-molding operation.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to electronic enclosure sealingdevices and, more particularly, to a device and method of forming aunitary electrically shielded panel.

[0003] 2. Description of the Related Art

[0004] Electromagnetic interference (“EMI”) is often the bane ofelectronic equipment and circuit designers. Federal regulations mandatethat electronic equipment enclosures must not radiate electromagneticsignals that interfere with other proximately located electronicequipment. Electronic equipment enclosures must also be sufficientlyshielded against interference from electromagnetic signals radiated fromother proximately located equipment. The challenge to designers tocontrol EMI becomes increasingly more difficult as the operating speedof electronic devices increases.

[0005] Currently, apertures defined in electronic equipment enclosuresare sealed using electrically shielded panels, e.g. circuit-packfaceplates, blank filler panels, covers, doors, etc., that may comprisea separate panel part and gasket. A metallic panel part will function asa conductive shield that spans the enclosure opening to reduce EMIpassage therethrough. Here, the gasket need only provide a perimeterseal between the panel part and the enclosure. The panel part may alsobe non-metallic, in which case a conductive paint or other similarconductive material must be applied to the surface of the panel partthat is to receive the gasket. The conductive paint serves as a shieldspanning the enclosure opening and the gasket provides a perimeter sealbelow the panel part and the enclosure. The gasket may be, for example,of metal, a metal-impregnated elastomer, or an elastomer wrapped in ametal sheath, and is affixed to the panel part in a subsequent operationafter the panel part is formed. The gasket may be secured to the panelpart by friction, adhesive, or by interlocking complementary parts onthe panel part and gasket. In other words, fabricating an electricallyshielded panel involves at least a two step process: 1) fabricating thepanel part; and thereafter 2) affixing a gasket thereto.

[0006] U.S. Pat. No. 5,641,438 to Bunyan et al. discloses a method ofextruding a fluent electrically conductive polymeric material onto arigid substrate to form a polymeric EMI gasket thereon. The polymericmaterial is then cured to produce a bead-like gasket on the substrate.However, the gasket disclosed in this reference is extruded onto thesubstrate as a secondary operation only after the substrate isfabricated and provides only a perimeter electrical seal.

[0007] U.S. Pat. No. 5,524,908 to Reis discloses a multi-layered EMIgasket having first and second electrically conductive layers, with thesecond layer being more rigid than the first. The second layer must beconductive and generally malleable to permit bending, folding, notchingand other forming of the disclosed EMI gasket. The layers may be securedtogether in a variety of ways including bonding, welding, laminating, orother art recognized affixation methods and techniques—ostensibly as athird step after the layers have been fabricated. However, after the EMIgasket disclosed in this reference is formed, it must then be fastenedto or between a substrate or other rigid material before it may be usedto electronically seal an enclosure opening.

SUMMARY OF THE INVENTION

[0008] The present invention advantageously provides a novel andunobvious device and method of forming a unitary electrically shieldedpanel that may be used to electrically seal an opening defined in anelectronic enclosure to reduce the passage of EMI through the enclosureopening. In accordance with the present invention, the unitaryelectrically shielded panel is formed of an electrically non-conductiverigid thermoplastic panel part and a substantially planar, electricallyconductive elastomeric gasket, i.e. a thermoplastic elastomer, in asingle tool during a single injection-molding operation.

[0009] In accordance with the method of the present invention, aunitarily formed electrically shielded panel is fabricated using asingle tool during a single, two-shot injection-molding operation. Acavity defined within the tool comprises two parts: a first cavity partsized and shaped for forming the rigid panel part; and a second cavitypart sized and shaped for forming the gasket. A first shot of thetwo-shot forming operation injects an electrically nonconductive rigidthermoplastic into the first cavity part to form the rigid panel partwhile a core is articulatably situated in the second cavity part—thecore being substantially the same size and shape as the gasket or thesecond cavity part. Following the first shot, the core is articulated soas to substantially vacate the second cavity part, and a second shot ofthe two-shot forming operation injects an electrically conductiveelastomer into the second cavity part to form the gasket. The conductiveelastomer chemically bonds to and with the electrically non-conductiverigid thermoplastic, thereby forming a unitary electrically shieldedpanel having an electrically non-conductive rigid thermoplastic panelpart and a substantially planar and coextensive electrically conductivegasket unitarily formed therewith.

[0010] The present invention is less costly to fabricate, requires noadditional assembly, and provides a uniform and reliable EMI sealbetween the electrically shielded panel and the electronic enclosure. Inaddition, the panel part and gasket are separable and completelyrecyclable.

[0011] Other objects and features of the present invention will becomeapparent from the following detailed description considered inconjunction with the accompanying drawings. It is to be understood,however, that the drawings are designed solely for purposes ofillustration and not as a definition of the limits of the invention, forwhich reference should be made to the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In the drawings, wherein like reference characters denote similarelements throughout the several views:

[0013]FIG. 1 is a front perspective view of a unitarily formedelectrically shielded panel in accordance with the present invention;

[0014]FIG. 2 is a rear perspective view of the shielded panel of FIG. 1;

[0015]FIG. 3 is a front face view of the shielded panel of FIG. 1;

[0016]FIG. 4 is a cross-sectional view of the shielded panel of FIG. 3taken along the lines 4-4 in FIG. 3;

[0017]FIG. 5 is a right side view of the shielded panel of FIG. 3 havinga circuit-pack attached thereto;

[0018]FIG. 6 is a rear face view of the shielded panel of FIG. 3;

[0019]FIG. 7 is a front view of an electronic equipment enclosure havinga plurality of electrically shielded panels constructed in accordancewith the present invention installed therein; and

[0020]FIG. 8 is a diagrammatic view of a two-shot injection-moldingapparatus for forming a unitary electrically shielded panel inaccordance with the method of the present invention.

DETAILED DESCRIPTION OF THE PRESENTLY PREFERRED EMBODIMENTS

[0021] The present invention advantageously provides a novel andunobvious unitarily formed electrically shielded panel that may be usedto physically and electromagnetically seal an opening defined in anelectronic equipment enclosure to reduce the passage of EMI through theenclosure opening. The present invention also provides a method offorming such a unitary electrically shielded panel. In accordance withthe present invention, the unitary shielded panel comprises anelectrically non-conductive rigid thermoplastic panel part that ischemically bound to and with a substantially planar, electricallyconductive elastomeric shield or gasket, both formed in a single tool ormold during a single injection-molding operation. The terms shield andgasket are used interchangeably herein in describing the substantiallyplanar elastomeric part of the inventive shielded panel.

[0022] Referring now to the drawings in detail, FIGS. 1 and 2 depict anelectrically shielded panel 10 constructed in accordance with thepresent invention. As used herein, the term panel is intended toinclude, by way of non-limiting example, circuit-pack faceplates, blankfiller panels, doors, covers, and other similar structure or devicesthat may be used to cover or seal an opening defined in an electronicequipment enclosure. The present invention applies to unitarily formedelectrically shielded panels of virtually any shape and size and is notintended to be limited to the generally rectangular shieldedcircuit-pack faceplate described herein, which is merely an illustrativeexample and not intended to define or otherwise limit the scope of thepresent invention. In addition, the terms electronic equipment enclosureand electronic equipment cabinet are used in their broadest sense torefer generally to structures that contain electronic components,devices, systems, apparatuses, and the like.

[0023] The unitary electrically shielded panel 10 comprises anelectrically non-conductive rigid thermoplastic panel part 20 and asubstantially planar, conductive elastomeric shield or gasket 30. Theshielded panel 10 is formed in a common or single tool or mold during asingle, two-shot injection-molding operation (as described in furtherdetail hereinbelow) during which the panel part 20 and gasket 30 arechemically bonded or bound together concurrent with their formation orfabrication to form the inventive unitary shielded panel 10. The panelpart 20 is generally rectangular in shape when viewed straight-on (i.e.from the front as in FIG. 3) and has two substantially parallelperipheral long sides 22 and two substantially parallel peripheral shortsides 24—the periphery of the panel part 20 defining a panel partfootprint 26 (see, e.g. FIG. 3). When the unitary shielded panel 10 isemployed as a circuit-pack faceplate, for example, the panel part 20 andgasket 30 may have a plurality of apertures 28 defined therethrough toaccommodate displays (e.g., LEDs) or other visual indicators, switches,and other operative or informative circuit-pack components as well asscrews or other fasteners utilized to secure the unitary shielded panel10 to an enclosure 40 (FIG. 7). It will be apparent to persons skilledin the art that the quantity, size and location of the apertures 28 willdepend upon the specific shape and intended application of the shieldedpanel 10. The panel part 20 and gasket 30 may alternatively comprisesubstantially solid or continuous parts, devoid of openings, apertures,and the like. Since the inventive shielded panel 10 may be used invarious configurations, it will be obvious to a person skilled in theart that the panel part 20 and gasket 30 may include, as a generalmatter of design choice, apertures, ridges, grooves, tabs, bosses, andnumerous other structural features to facilitate use of the panel 10.

[0024] The panel part 20 is preferably formed from an electricallynon-conductive rigid thermoplastic such, by way of non-limiting example,as polyetherimide (PEI), polysulfone, polycarbonate, or polybutal (PBT),although other thermoplastics are also contemplated by the presentinvention.

[0025] As shown more clearly in FIGS. 2 and 6, the gasket 30 forms asubstantially planar and coextensive conductive shield that covers therear surface of the panel part 20. The gasket 30 is generallyrectangular in shape when viewed straight-on (as in FIG. 6) and has aperiphery defining a gasket footprint 36 that is, at least in part,peripherally larger than the panel footprint 26. Specifically, thegasket 30 is wider than the panel part 20 preferably over most of itslongitudinal length as depicted in FIGS. 3 and 4. Thus, when two or moreelectrically shielded panels 10 are placed side-by-side, as depicted inFIG. 7, the long sides 32 of the gaskets 30 of immediately adjacentelectrically shielded panels 10 abuttingly contact each other so as toprovide a physical and electrical seal therebetween—effectively forminga substantially continuous and planar electrical shield for electricallysealing an opening 50 defined in an electronic enclosure 40. The gasket30 is preferably formed of a thermoplastic elastomer blended with aconductive filler and is sufficiently compatible with the non-conductivethermoplastic panel part 20 to permit the two materials to bond togetherduring formation of the panel 10 in a single tool during a two-shotinjection molding process. The compatibility also prevents adversereaction between the conductive and non-conductive materials duringformation and use of the inventive panel 10. The compatibility furtherensures sufficient bonding between the dissimilar materials as the panel10 is fabricated and during the useful life of the panel 10 yet permitstheir selective separation for recyclability. The materials may bechemically and/or mechanically bonded together—mechanical bondingresulting from the high pressure at which the two materials areprocessed during formation of the panel 10. Exemplary, non-limitingelastomers include ethylene-propylene-diene-terpolymers and styreneblock copolymers. The conductive filler may by way of example comprise ashort or long graphite fiber compound or a graphite powder. It willnevertheless be obvious to persons skilled in the art that otherelectrically conductive elastomers may alternatively be used to form thegasket 30 without departing from the spirit of the present invention.

[0026] When the inventive shielded panel 10 is configured as acircuit-pack faceplate, as is depicted for example in the drawings, therigid panel part 20 will generally include a plurality of mounting tabs21 that extend substantially perpendicularly outward therefrom. (See,e.g., FIGS. 4 and 5). The gasket 30 may also include a plurality ofconductive tabs 31 located near and spaced apart from the mounting tabs21 and extending generally parallel thereto. In this arrangement, acircuit-pack 60 may be attached to the tabs 21, 31 using any suitabletype of art-recognized attachment means or methods for mechanically andelectrically attaching the circuit-pack 60 to the shielded panel 10.

[0027] Referring next to FIG. 7, an electronic equipment enclosure 40 isdepicted having a plurality of electrically shielded panels 10 disposedin adjacent abutting relation to each other so as to provide anelectromagnetic barrier or seal over an aperture 50 defined in theenclosure 40. For this illustrative example, the aperture 50 defines theopening through which circuit-packs are operatively inserted into theenclosure 40, although the aperture 50 may alternatively be an accessopening in the enclosure 40, a single circuit-pack opening, or any othernumber of functional openings. The gasket 30 of each electricallyshielded panel 10 serves at least three purposes: first, it electricallycontactingly engages the electronic enclosure 40 at least along theshort sides 34 of the gasket 30; second, it abuttingly contacts thegasket 30 of adjacent electrically shielded panels 10; and third, itprovides a substantially planar shield that attenuates or reduces thepassage of EMI through the aperture 50. Thus, when a plurality of theinventive panels 10 are installed in the enclosure 40 so as tocompletely fill the expanse of the aperture 50, the plural panels 10effectively seal the aperture 50 and substantially block or reduce thepassage of EMI therethrough. Consequently, the enclosure 40 radiatesless EMI and is less susceptible to EMI radiated by other electronicdevices. The plural inventive panels 10 depicted in FIG. 7 and discussedin the illustrative example hereinabove may consist of any combinationof circuit-pack faceplates, blank filler panels or covers.Alternatively, a single electrically shielded panel 10 may be sized andshaped to sealingly cover the entire aperture 50.

[0028] The present invention additionally provides a method of forming,in a common or single tool or mold and during a single injection-moldingoperation, a unitary electrically shielded panel 10 having anon-electrically conductive rigid thermoplastic panel part 20 chemicallybound to and integrally carrying a substantially planar and coextensiveelectrically conductive elastomeric shield or gasket 30. As used herein,the term injection-molding includes without limitation gas-assistinjection-molding, high-pressure and low-pressure structural foaminjection-molding, and other art-recognized thermoplastic and thermosetpressure-based forming methods and processes. The inventive method,diagrammatically depicted by the apparatus of FIG. 8, is preferably atwo-shot injection-molding process, although other processes suitablefor molding or otherwise forming thermoplastics are also contemplated byand within the scope of the present invention. A tool or mold 120 has afirst cavity 140 defined therein in the approximate size and shape ofthe panel part 20. A second cavity 150 is defined within the tool 120immediately adjacent the first cavity 140 so that the first and secondcavities 140, 150 are relatively positioned in the same manner in whichthe panel part 20 and gasket 30 are relatively positioned in thecompleted panel 10, and is preferably the approximate size and shape ofthe gasket 30. The tool 120 is configured for a two-shotinjection-molding process during which a first shot injects anelectrically non-conductive rigid thermoplastic 100 into the firstcavity 140 to form the rigid panel part 20. After a predetermined timeperiod, i.e. the time required for the thermoplastic 100 to change froma liquid to a solid, a second shot injects an electrically conductiveelastomer 110 into the second cavity 150 to form the gasket 30 whichbonds to it with the panel part 20 concurrent with its formation in themold 120. For the preferred thermoplastic (i.e. polyetherimide), thepredetermined time period is between approximately 15 and 30 seconds. Itwill be obvious to persons skilled in the art that the time periodrequired for other thermoplastics to change from a liquid to a solid mayvary. During the first shot, an articulatable core 130 is located withinthe second cavity 150 and preferably conforms to the size and shape ofthe cavity 150. The core 130 is articulated so as to substantiallyvacate the second cavity 150 prior to the second shot. The electricallyshielded panel 10 produced by the hereindescribed method is anintegrated and unitary device comprised of an electrically nonconductiverigid thermoplastic panel part 20 that is chemically joined and bound toand with a substantially planar, electrically conductive elastomericgasket 30. It is thus possible, according to the present invention, toreliably, quickly and inexpensively fabricate an electromagnetic shieldpanel.

[0029] Both the first and second shot occur during a single formingoperation and thus form the inventive electrically shielded panel 10during a single, two-shot injection-molding process.

[0030] Thus, while there have shown and described and pointed outfundamental novel features of the invention as applied to preferredembodiments thereof, it will be understood that various omissions andsubstitutions and changes in the form and details of the devicesillustrated, and in their operation, may be made by those skilled in theart without departing from the spirit of the invention. For example, itis expressly intended that all combinations of those elements and/ormethod steps which perform substantially the same function insubstantially the same way to achieve substantially the same results arewithin the scope of the invention. It is the intention, therefore, to belimited only as indicated by the scope of the claims appended hereto.

What is claimed is:
 1. A unitary electrically shielded panel installablein an electronic equipment enclosure for electrically sealing anaperture defined in the enclosure against passage of electromagneticradiation, said electrically shielded panel comprising: an electricallynon-conductive rigid panel part having a periphery; and a substantiallyplanar electrically conductive shield formed unitarily with said panelpart and substantially coextensive with said panel part so that saidshield overlaps and extends beyond said periphery of said panel part sothat said electrically shielded panel operatively reduces passage ofelectromagnetic energy through the enclosure aperture when saidelectrically shielded panel is sealingly placed over the enclosureaperture.
 2. The shielded panel of claim 1 , wherein said shieldcomprises a gasket that electrically connects said shielded panel to theenclosure when said shielded panel is installed in the enclosure.
 3. Theshielded panel of claim 1 , wherein said shield is chemically bound tosaid panel part.
 4. The shielded panel of claim 1 , wherein said panelpart is formed from a thermoplastic.
 5. The shielded panel of claim 4 ,wherein said panel part is formed from polyetherimide.
 6. The shieldedpanel of claim 4 , wherein said shield is formed from a thermoplasticelastomer.
 7. The shielded panel of claim 6 , wherein said shieldcomprises a gasket that electrically connects said shielded panel to theenclosure when said shielded panel is installed in the enclosure.
 8. Theshielded panel of claim 6 , wherein said shield is chemically bound tosaid panel part.
 9. The shielded panel of claim 1 , wherein said panelpart periphery defines a panel part footprint and said shield has aperiphery that defines a shield footprint, at least a portion of saidshield footprint being larger than said panel part footprint.
 10. Theshielded panel of claim 1 , wherein said shielded panel is configured asa faceplate for a circuit-pack having a circuit ground, said panel partand said shield have a plurality of apertures defined therein, saidpanel part further comprising a mounting tab for mounting thecircuit-pack to said shielded panel, said shield further comprising aconductive tab for electrically connecting the circuit ground to saidshield and thereby electrically connecting the circuit ground and saidshield to the electronic enclosure when said shielded panel is installedin the enclosure.
 11. A method of forming during a single formingoperation an electrically shielded panel unitarily formed of anelectrically non-conductive rigid part and a substantially planar andcoextensive electrically conductive shield, said method comprising thesteps of: (a) introducing an electrically non-conductive thermoplasticin a flowable state into a first part of a cavity defined in a tool, thetool cavity having a second part having an articulatable core sized andshaped to fit within the second part of the tool cavity and initiallydisposed therein; (b) permitting the electrically non-conductiveflowable-state thermoplastic to at least partly solidify within thefirst part of the tool cavity; (c) following said step (b), articulatingthe core so as to remove the core from the second part of the toolcavity; and (d) following said step (c), introducing into the secondpart of the tool cavity an electrically conductive elastomer that bondswith the electrically non-conductive thermoplastic in the first part ofthe cavity to form a unitary electrically shielded panel having anelectrically non-conductive rigid part and a substantially planar andcoextensive electrically conductive shield.
 12. The method of claim 11 ,wherein the bond between the electrically conductive elastomer and theelectrically non-conductive thermoplastic is at least partly a chemicalbond.
 13. The method of claim 12 , wherein the bond between theelectrically conductive elastomer and the electrically non-conductivethermoplastic is at least partly a mechanical bond.
 14. The method ofclaim 11 , wherein said electrically non-conductive thermoplasticcomprises polyetherimide.
 15. The method of claim 14 , where said step(b) further comprises waiting between approximately 15 to 30 seconds forthe non-conductive thermoplastic to at least partly solidify.
 16. Themethod of claim 11 , wherein said step (a) further comprises injectingthe electrically non-conductive rigid thermoplastic into the firstcavity part under high pressure, and said step (d) further comprisesinjecting the electrically conductive elastomer into the second cavitypart under high pressure.
 17. The method of claim 16 , wherein saidelectrically non-conductive thermoplastic comprises polyetherimide. 18.The method of claim 17 , where said step (b) further comprises waitingbetween approximately 15 to 30 seconds for the non-conductivethermoplastic to at least partly solidify.
 19. The method of claim 11 ,wherein said step (a) further comprises injecting the electricallynon-conductive rigid thermoplastic into the first cavity part under lowpressure, and said step (d) further comprises injecting the electricallyconductive elastomer into the second cavity part under low pressure. 20.The method of claim 19 , wherein said electrically non-conductivethermoplastic comprises polyetherimide.
 21. The method of claim 20 ,where said step (b) further comprises waiting between approximately 15to 30 seconds for the non-conductive thermoplastic to at least partlysolidify.
 22. A unitary electrically shielded panel installable in anelectronic equipment enclosure for electrically sealing an aperturedefined in the enclosure against passage of electromagnetic radiation,said electrically shielded panel comprising: an electricallynon-conductive rigid panel part formed by introducing an electricallynon-conductive thermoplastic in a flowable state into a first part of acavity defined in a tool, the cavity having a second part having anarticulatable core initially disposed therein; and a substantiallyplanar electrically conductive shield formed unitarily with said panelpart and substantially coextensive with said panel part and formed byarticulating the core from the second part of the tool cavity so as toremove the core from the second part of the tool cavity after saidforming of said rigid panel part and thereafter introducing into thesecond part of the tool cavity an electrically conductive elastomer thatchemically bonds together with said panel part in the first part of thetool cavity so that said shield overlaps said panel part to thereby formsaid electrically shielded panel for operatively reducing passage ofelectromagnetic energy through an aperture of an enclosure when saidelectrically shielded panel is sealingly placed over the enclosureaperture.
 23. The shielded panel of claim 22 , wherein said shieldcomprises a gasket that electrically connects said shielded panel to theenclosure.
 24. The shielded panel of claim 22 , wherein said panel partis formed from polyetherimide.
 25. The shielded panel of claim 24 ,wherein said shield is formed from a thermoplastic elastomer.
 26. Theshielded panel of claim 25 , wherein said shield comprises a gasket thatelectrically connects said shielded panel to the enclosure when saidshielded panel is installed in the enclosure.